Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Applied Materials Centura 5200 DXZ, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | Centura 5200 DXZApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Applied Materials Centura 5200 DXZ |
| Cited variants | — | |
| Specifications | ||
| Make | Applied Materials[3] | — |
| Model | 0010-22161[3] | Centura 5200 DXZ[5] |
| Description | HTESC PH 1 REV A[4] | PECVD (Chemical Vapor Deposition)[1] |
| Condition | Used[4] | — |
| Stock Number | BM6628[4] | — |
| Wafer Size | — | 200 mm[1] |
| Process Type (available) | — | PECVD, SACVD[1] |
| Number of Chambers (SACVD variant) | — | 3[2] |
| Chemistry (SACVD variant) | — | TEOS[2] |
| OEM | — | Applied Materials[5] |
| Version | — | 200 mm[1] |
| Vintage | — | 01.06.1997[2] |