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0010-13622 RF Match forversus3290 STQ

Applied Materials 0010-13622 RF Match for, Novellus 3290 STQ, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
3290 STQNovellus
OEMApplied MaterialsNovellus
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forNovellus 3290
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]Recent model control system[2]
Model0010-13622[1]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
Phase—3 Phase[2]
Frequency—50 Hz[2]
DC Power Supply—12 / 12 / 12 kW, 208 V[2]
Load Lock Pump—Varian V 70 Turbo Pump[2]
Wafer Size—6 inch[3]
Power Supply Phase/Frequency—3 Phase, 50 Hz[2]
Optional DC Power Supply—6 / 6 / 12 kW, 208 V (option for 12 /12 / 12 kW AE Pinnacle at 400 V)[2]
Control System—Recent model control system with touch screen from both sides[2]
Temperature Controller—Latest version[2]
Cryo Pumps—CTI Cryo Pumps[2]
Water Pumps—Included[2]
Mass Flow Controllers—Upgrade to MFC vs. needle valve[2]
Pressure Controller—New[2]
Preheating—Installed Heater for Preheating (no RF Etch Position)[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing