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Comparison ledger

NexDepversus0020 18698 Part

Angstrom Engineering NexDep, Applied Materials 0020 18698 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
NexDepAngstrom Engineering
0020 18698 PartApplied Materials
OEMAngstrom EngineeringApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAngstrom Engineering NexDepApplied Materials 0020 18698 Part
Cited variants—
Specifications
E-Beam pocket configuration6 x 7 cc multi-pocket E-Beam[1]—
Chamber dimensions16" x 16" x 28"[1]—
Chamber typeHigh aluminum high vacuum box chamber[1]—
Base pressure< 5 x 10^-7 Torr in a clean system[1]—
Power supply3 kW[1]—
Evaporation sourcesDual resistive evaporation sources[1]—
ControlPC control station with fully automated sequences and software for deposition control[1]—
Deposition modesCombined co-deposition processing with e-beam and thermal or thermal and thermal processing; not e-beam and e-beam processing[1]—
Multi-layer controlMulti-layer deposition control[1]—
CategoryThermal E-Beam Evaporator (PVD)[1]—
E-Beam Multi-Pocket6 x 7 cc[1]—
Chamber Dimensions16" x 16" x 28" (high aluminum high vacuum box chamber)[1]—
Base Pressure (clean system)< 5 x 10-7 Torr[1]—
Debris ShieldsOne set removable stainless steel debris shields[1]—
Chamber DoorHinged chamber front door for easy internal access[1]—
ViewportLarge viewport offset to reduce material deposition[1]—
Vacuum Chamber MaterialHigh aluminum[1]—
Ion Assisted Deposition (Nexdep 2 only)Supported[1]—
Configuration—Dial Cover, Side Local Match, Hdpcvd, Ul[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]pnf.uchicago.edupnf.uchicago.edu
  2. [2]inventory listing