Comparison ledger
AJA Q2, Applied Materials 0020 23839 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Q2AJA | 0020 23839 PartApplied Materials |
|---|---|---|
| OEM | AJA | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | AJA Q2 | Applied Materials 0020 23839 Part |
| Specifications | ||
| System name | AJA Quantum Materials Sputter Deposition System[1] | — |
| Tool location | 106[1] | — |
| Compatibility | 1E - Silicon Based Materials and Select Dieletrics[1] | — |
| Tool type | loadlocked UHV sputter deposition system[1] | — |
| Sputtering capability | RF and DC sputtering capability[1] | — |
| Substrate pre-treatment | RF substrate pre-treatment[1] | — |
| Substrate cleaning | in chamber ion source for substrate cleaning[1] | — |
| Sputter guns | two sputter guns for deposition of various materials[1] | — |
| Off-axis sputter guns | two manually adjustable off axis sputter guns for low energy sputter deposition[1] | — |
| Primary materials | Aluminum, Niobium, Tantalum and Titanium[1] | — |
| Configuration | — | Plate, Sensor Clamp, Hdpcvd Ultima +[2] |
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