Comparison ledger
Aixtron 2600 G 3 HT IC MOCVD Reactor, Applied Materials 0010-13622 RF Match for, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2600 G 3 HT IC MOCVD ReactorAixtron | 0010-13622 RF Match forApplied Materials |
|---|---|---|
| OEM | Aixtron | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Aixtron AIX 2600 | Applied Materials 0010-13622 RF Match for |
| Specifications | ||
| Configuration | Software Version; AIXACT 7.4.1.9[1] | High Efficiency HE RF Match-Bias[3] |
| PLC | 3.12.1[1] | — |
| Process | InGaN MOCVD Epitaxy[1] | — |
| Wafer | 6 x 6"[1] | — |
| Metal organic Sources | TMIn x 3, TMGa x 2, TMAl x 1, CP2Mg x 1, Future x 3[1] | — |
| Hydride Sources | NH3 x 3, 100 ppm SiH4 in AR x 2, Future x 2[1] | — |
| Concentration Monitors | Epison4 x 3 for TMln, Epison 4 x 1 for TMAl[1] | — |
| Purifiers | Entegris Getters for NH3, H2 & N2[1] | — |
| Heating System | RF Coil with Trumpf Huttinger RF Generator BIG 120/50[1] | — |
| Glove Box | MBraun Nitrogen Glovebox with Controller[1] | — |
| Process Pump | Ebara ESA 70 W or ESA 80 W[1] | — |
| DOR & Glove Box Pumps | Adixen ACP-15(G) x 2[1] | — |
| Abatement | Unisem UN2000A-WHG (single or shared across 2 reactors)[1] | — |
| Reactor Chillers | Tek-Temp Recirculating Closed Lop Chiller[1] | — |
| OEM | Aixtron[1] | — |
| Model | 2600 G 3 HT IC[1] | 0010-13622[3] |
| Category | Deposition[2] | — |
| Tool type | MOCVD Reactor[1] | — |
| Software version | AIXACT 7.4.1.9[1] | — |
| Vacuum/exhaust | Custom Built Exhaust System[2] | — |
| Reactor chiller | Tek-Temp Recirculating Closed Lop Chiller[1] | — |
| In-situ pyrometry | available[1] | — |
| Gas Foil Rotation (GFR) | Individual GFR Control for Each Puck[1] | — |
| Spare Channels | 23 Spare MFC Channels & 10 Spare Valve output Channels[1] | — |
| Product Type | — | RF Match for PVD (Physical Vapor Deposition)[3] |
| Feature | — | High Efficiency HE RF Match-Bias[3] |
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