Comparison ledger
Accretech UF3000 Fully Automated, Applied Materials 0720 06060 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF3000 Fully AutomatedAccretech | 0720 06060 PartApplied Materials |
|---|---|---|
| OEM | Accretech | Applied Materials |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF3000 Fully Automated | Applied Materials 0720 06060 Part |
| Specifications | ||
| -Loader Type | TSK[1] | — |
| -Chuck Temperature Range | 30~150℃[1] | — |
| -OCR Camera Type | Type6[1] | — |
| -Auto Card Change | Yes[1] | — |
| -Needle Cleaning Unit | 150mm x 150mm Ceramics Pad[1] | — |
| -Manipulator | Hinge, MHF4000[1] | — |
| -Test System Interface | AL6050 & Focus3000[1] | — |
| Attachments | 10 Files[1] | — |
| Manufacturer | Accretech / TSK[1] | — |
| Model | UF3000[1] | — |
| Description | Fully Automated Prober[1] | — |
| Version | 300 mm[1] | — |
| Vintage | 01.05.2009[1] | — |
| Wafer size support | 200 mm (8") and 300 mm (12")[2] | — |
| Alignment accuracy | ±2 microns[2] | — |
| Z-axis accuracy | ±1 micron[3] | — |
| Maximum chuck temperature | 200°C[3] | — |
| Minimum chuck temperature | -40°C[3] | — |
| Probe card compatibility | Universal compatibility with various probe card types[3] | — |
| Throughput rate | Up to 300 wafers per hour[3] | — |
| Software version | S5.0FC4[1] | — |
| Includes | Printer[1] | — |
| S/W version | S5.0FC4[1] | — |
| Configuration | — | Contact Pin 24-20 Awg Crimp Gold Flash[4] |
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