Waferpedia

Comparison ledger

UF 3000 EXversusP 12 XL

Accretech UF 3000 EX, Tokyo Electron P 12 XL, side by side. Every value shown is drawn from the cited encyclopedia entries.

LinkedIn X Email
Documented as functional equivalents— Same function class: Test & Probe, null[1]
Side-by-side comparison of selected equipment models
Attribute
UF 3000 EXAccretech
P 12 XLTokyo Electron
OEMAccretechTokyo Electron
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 3000Tokyo Electron P 12
Specifications
ConfigurationAuto-tilt Option[2]Tri-Temp[5]
HFMHF 9000 EX[2]—
Aard HolderNobinite[2]—
Card ExchangeAPC[2]—
Temp50℃～150℃[2]—
Cleaning Unit250 x 155 (notched)[2]—
Tester I/FGPIB[2]—
CPUAdvme 7509[2]—
Wafer Size12 inch[4]12 inch[8]
Auto-tilt OptionIncluded[2]—
Tri-TempIncluded[2]Tri-Temp 2002 (10), 2003 (3), 2004, 2005 Vintage[5]
Chuck Temperature Range50℃～150℃[2]—
Compatible Tester ModelsIP 750 EX-HD[2]—
Card Holder MaterialNobinite[2]—
Tester InterfaceGPIB[2]—
Prober TypeProber[2]—
Wafer Sizes12 inch[4]—
Auto-tilt optionYes[2]—
No ChillerYes[2]—
Vintage2007[2]—
Process—PPF[5]
Phase—1 Phase[6]
Voltage—208 V[6]
OEM—Tokyo Electron[5]
Model—P 12 XL[5]
Equipment type—Prober[5]
Wafer sizes—12 inch[5]
UF 3000 EX entryP 12 XL entryAsk about these tools →Share experience with this comparison →

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (9)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]Equipment inventory listing
  9. [9]Equipment inventory listing