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UF 3000 EX Automatic Waferversus0720 06060 Part

Accretech UF 3000 EX Automatic Wafer, Applied Materials 0720 06060 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0720 06060 PartApplied Materials
OEMAccretechApplied Materials
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 3000Applied Materials 0720 06060 Part
Specifications
OS VerS6.39.BH[1]—
InputAC 210V Single pulse[1]—
Configuration12" Nickel Hot Chucktop[1]Contact Pin 24-20 Awg Crimp Gold Flash[4]
Head Plate Center Hole Size528mm[1]—
TypeAutomatic wafer prober[2]—
Hot temp controllerRoom~150C[1]—
OS versionS6.39.BH[1]—
Chucktop12" Nickel Hot Chucktop[1]—
Z stageStandard Z Force Stage[1]—
LoaderOpen Foub Single Loader[1]—
OCRType 6 OCR (Rear-Face Only)[1]—
Probe card trayAuto Probe Card Tray (O)[1]—
Cleaning unit blockCleaning Unit Block (O), Cleaning Ceramic Plate(X)[1]—
PortsUSB Port; Ethernet Port[1]—
Card holder clamp motor optionNo[1]—
Auto tilt optionNo[1]—
Configured wafer sizes8" or 12" wafers[3]—
Chuck typeNickel[3]—
FOUP portSingle FOUP port for 25 wafers[3]—
TransportDual robotic wafer transport arms[3]—
AlignmentAuto needle alignment; advanced wafer alignment unit; alignment camera E1-500[3]—
StageQuad-Pod Z stage[3]—
Interface optionsGPIB interface option; Ethernet interface option[3]—

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]jadgrp.comjadgrp.com
  4. [4]inventory listing