Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF3000, KLA RS 35 Sheet Resistance Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF3000Accretech | |
|---|---|---|
| OEM | Accretech | KLA |
| Category | — | — |
| Wafer size | Wafer Equipment | One wafer manual loader |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF3000 | KLA RS 35 |
| Cited variants | — |
|
| Specifications | ||
| Wafer size | Wafer Equipment[2] | One wafer manual loader[5] |
| Currently Configured for | 300mm[2] | — |
| With Chiller | SCU-600B[2] | — |
| Section 1 | Tool General Information[2] | — |
| Section 2 | Tool Specific Information[2] | — |
| Manufacturer | Accretech, Tokyo Semitsu Kogaku (TSK)[2] | — |
| Model | UF3000[2] | — |
| Category | Wafer Equipment[2] | — |
| Equipment type | Wafer Prober[2] | — |
| Tool status | In production[2] | — |
| Tool location | Cleanroom[2] | — |
| Chiller | SCU-600B[2] | — |
| Vendor tool serial number | F24006MZ[2] | — |
| Micron MISTI/LID number | FE3SKAA300(TMM)[2] | — |
| Year | 2004[3] | — |
| Quantity | 9[4] | — |
| Short description | Fully Automated Prober[4] | — |
| Version | 300 mm[4] | — |
| Nickel chuck | 12 inch[4] | — |
| Front loading | 300 mm single FOUP loading[4] | — |
| Robot blade | Dual ceramic robot blade[4] | — |
| Software version | S5.0FC4[4] | — |
| Loader type | TSK[4] | — |
| Chuck temperature range | 30~150℃[4] | — |
| OCR camera type | Type6[4] | — |
| Auto card change | Yes[4] | — |
| Needle cleaning unit | 150 mm x 150 mm ceramics pad[4] | — |
| Manipulator | Hinge, MHF4000[4] | — |
| Test system interface | AL6050 & Focus3000[4] | — |
| Includes | Printer[4] | — |
| Configuration | — | Scan stage[5] |
| Process vac | — | 23 InHg[5] |
| CDA | — | 100 PSI[5] |
| Inlet Power | — | 1 line of 115 vac, 8 amp[5] |
| Wafer Size | — | 6 inch[5] |
| Wafer Handling | — | One wafer manual loader[5] |
| Scan Stage | — | Yes[5] |
| Process Vacuum | — | 23 InHg[5] |