Waferpedia

Comparison ledger

, Tokyo Semitsu Kogaku (TSK) UF200versus3696

Accretech , Tokyo Semitsu Kogaku (TSK) UF200, GCA 3696, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3696GCA
OEMAccretechGCA
Category——
Wafer sizeWafer Equipment150mm
Process node—legacy semiconductor lithography equipment
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—g-line
FamilyAccretech , Tokyo Semitsu Kogaku (TSK) UF200GCA 3696
Cited variants—
  • GCA 6300 DSW 5X g-line Wafer Stepperg-line[1]
Specifications
Wafer sizeWafer Equipment[2]3" up to 150mm; smaller pieces[1]
Date of Manufacture1998[2]—
Currently Configured for200mm[2]—
Current Equipment StatusAvailable[2]—
Available dateCurrently Available[2]—
Equipment categoryProduction Wafer Prober[2]—
Instrument type—Photorepeater system[1]
Conversion note—Can be easily converted to function as a GCA 3696 Photorepeater system[1]
Exposure target—Photoresist-coated glass plates[1]
Maximum plate size—Up to 7"[1]
Exposure wavelength—g-line (436nm)[1]
Numerical aperture—0.30 N.A.[1]
Reduction—5:1 reduction[1]
Field size—Variable field size up to 15mm square[1]
Minimum feature size—<0.9µm[1]
Registered alignment—Typically <0.25µm[1]
Mask size—5" x 0.090"-thick masks[1]
Stage motion—Laser-controlled stage motion[1]
Type—Step-and-repeat camera (stepper)[3]
Lens—Zeiss lens with 0.30 numerical aperture[1]
Resolution—0.9 µm[1]
Reduction ratio—5:1[1]
Control computer—DEC PDP-11/04[3]
Interface chassis—9280 Interface Chassis[3]
Sources (3)Every fact above is drawn from these public sources
  1. [1]cnfusers.cornell.educnfusers.cornell.edu
  2. [2]dealer listingwotol.com
  3. [3]trilicium.catrilicium.ca