Comparison ledger
Accretech SS 20 Automatic Dicing, Blanchard 20 36 Surface, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SS 20 Automatic DicingAccretech | 20 36 SurfaceBlanchard |
|---|---|---|
| OEM | Accretech | Blanchard |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech SS 20 Automatic Dicing | Blanchard 20 36 Surface |
| Cited variants |
| — |
| Specifications | ||
| Max workpiece size (round wafers) | 250 mm[2] | — |
| Max workpiece size (square wafers) | 250 mm[2] | — |
| Spindle speed (standard) | 60,000 rpm[2] | — |
| Spindle speed (optional) | 80,000 rpm[2] | — |
| Display | 17-inch touchscreen[2] | — |
| Kerf check function | Yes[2] | — |
| Maximum wafer diameter (circular) | 250 mm[2] | — |
| Maximum square wafer size | 250 mm x 250 mm[2] | — |
| Maximum sample thickness (tape-mounted) | 1 mm[3] | — |
| Compatible wafer sizes (reported at one facility) | up to 8 inches (200 mm) diameter[3] | — |
| Configuration | — | With new Elecro-Matic Neutrol II Magnetic Chuck Control[4] |
| Magnetic Chuck Control | — | Electro-Matic Neutrol II[4] |
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