Comparison ledger
ABM -407B-2-S-CE-S293 Robot, SUSS MicroTec ACS 200 Linear Wafer Tracks, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS 200 Linear Wafer TracksSUSS MicroTec | |
|---|---|---|
| OEM | ABM | SUSS MicroTec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2016 Reference use in 2016 |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | SUSS MicroTec ACS 200 Linear Wafer Tracks |
| Cited variants | — |
|
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[2] | — |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Equipment type | — | Resist coater/developer[3] |
| Wafer size | — | 6 inch[3] |
| Product description | — | 200mm automated coater & developer[1] |
| Supported wafer range | — | 100 mm to 200 mm wafers[1] |
| Coating/development modes | — | Automated photoresist coating and developing[4] |
| Process capabilities | — | Spin coating and spray coating[4] |
| Hotplate baking temperature | — | Up to 250 °C[4] |
| Edge-bead removal | — | Automated edge-bead removal with backside rinse[4] |
| Supported substrate diameter | — | Maximum wafer diameter: 200 mm (8 in)[4] |
| Supported wafer diameters | — | 50 mm, 75 mm, 100 mm, 150 mm, 200 mm[4] |
| Supported small pieces | — | Yes[4] |
| Maximum substrate thickness | — | 5 mm[4] |
| Photomask sizes supported | — | 125 mm x 125 mm; 150 mm x 150 mm[4] |