Comparison ledger
ABM -407B-1-S-CES293 Robot, Fuji NXT II Placement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NXT II PlacementFuji | |
|---|---|---|
| OEM | ABM | Fuji |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | Fuji NXT II Placement |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[2] | NXT II[3] |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| Make | — | Fuji[3] |
| Vintage | — | 2013[3] |
| Inventory ID | — | 140603-001[4] |
| Fuji serial number | — | 665[4] |
| Hours | — | 17,166[4] |
| Base | — | 4M Base with (2) M6II Modules H01 Heads Installed Dual Lane Independent Base[4] |
| Feeder capacity | — | M3II - Up to 20 types (8 mm tape); M6II - Up to 45 types (8 mm tape)[4] |
| PCB size | — | Double conveyor: 48 x 48 mm to 534 x 510 mm; single conveyor: 48 x 48 mm to 534 x 610 mm[1] |
| PCB load time | — | Double conveyor: continuous 0 sec; single conveyor: 2.5 sec (M3II only); single conveyor: 3.4 sec (M6II only)[4] |
| Placing accuracy | — | Chips: ±0.05 mm (3 sigma); four side leaded: 0.03 mm (3 sigma)[4] |
| Throughput | — | H12HS: 22,500 CPH; H08: 10,500 CPH; H04: 6,500 CPH; H02: 5,600 CPH; H01: 4,200 CPH[4] |
| Applicable components | — | H12HS: 0402 (01005) to 7.5 x 7.5 mm, max height 3.0 mm; H08: 0402 (01005) to 12 x 12 mm, max height 6.5 mm; H04: 1608 (0603) to 38 x 38 mm, max height 9.5 mm; H02/H01: 1608 (0603) to 74 x 74 mm (32 mm x 180 mm), max height 25.4 mm[4] |
| Module width | — | M3II - 320 mm; M6II - 645 mm[4] |
| Machine dimensions | — | 4MII base: L 1390 mm x W 1934 mm x H 1474 mm; 2MII base: L 740 mm x W 1934 mm x H 1474 mm[4] |